| Category | Technical Specification |
|---|---|
| Materials | FR4, aluminum, teflon, copper bases & more |
| Surface Finish | HASL, ENIG, OSP, Immersion Silver & Immersion Tin |
| Layer Count | Single-sided to 32 layers |
| Trace/Space | down to .003" |
| Max. Panel size | up to 21"x 26" |
| Panel thickness | up to .250" |
| Copper Weight | 0.5- 4oz. inner / 1-20oz. outer |
| Additional Capabilities | Mixed dielectric (hybrid) constructions; Embedded coin, or metal core and metal backed MLB; Blind and buried vias, Via-in-pad, Plated Over Filled Vias (POFV); Customizable Serialization; Control-Depth Drilling (stub removal); Plasma Etchback; Castellated Vias; Edge Plating; Plated Slots/Countersink/Counterbores |
